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Comparison ledger

BJ 820 Wire Bonder Transportversus10490

Hesse & Knipps BJ 820 Wire Bonder Transport, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps BJ 820 Wire Bonder TransportWest Bond 10490
Specifications
MakeHesse & Knipps (H&K)[1]—
ModelBJ 820[1]10490[3]
DescriptionWire Bonder Transport System[1]Convertible bonder, wedge to ball[4]
Vintage2013[1]—
Work area305 mm x 410 mm[2]—
TypeHigh Speed Fully Automatic Wedge Bonder[2]—
Wire materialsAluminium or gold wire or ribbon[2]—
Equipment typeWire Bonder Transport System[1]—
Machine descriptionHigh Speed Fully Automatic Wedge Bonder[2]—
Working area305 mm x 410 mm (12.3" x 16.14")[2]—
SpeedUp to 7 wires per second[2]—
Wire diameter range17.5 μm – 60 μm; optional 12.5 μm – 85 μm[2]—
Ribbon materialsAl, Au[2]—
Ribbon range6 μm x 35 μm – 25 μm x 250 μm[2]—
Footprint722 mm x 1250 mm[2]—
Integrated controlsIntegrated PLC controller; standard SMEMA input and output ports; Profibus support[2]—
Manufacturer—West Bond[3]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]keers-technologies.comkeers-technologies.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com