Waferpedia

Comparison ledger

1088versusPB6-2P-CP

Heller 1088, YES PB6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMHellerYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—5 in, 6 in, or 4 in wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088YES PB6-2P-CP
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[1]—
Heating MethodForced convection[1]—
Conveyor Width18 inches (45 cm)[1]—
Heated Length43.5 inches (111 cm)[1]—
Overall Length96 inches (244 cm)[1]—
Height50 inches (127 cm)[1]—
Net Weight900 lbs (409 kg)[1]—
Thermal ProfilerIncluded[1]—
Oven TopCounter balance for easy access to conveyor[1]—
Solder CompatibilityLead-free and leaded soldering[1]—
Model—YES-PB-6-2P-CP[2]
Product line—YES 450PB Bake Ovens[2]
Process type—High temperature vacuum bake/cure ovens for BCB/Polyimide[2]
Maximum operating temperature—Up to 450°C[2]
Wafer capacity—2 cassettes of 5" or 6" wafers, or 3 cassettes of 4" wafers[2]
Chamber material—316L SS[2]
Oven chamber size—10.75 in ID x 22.2 in deep x 7.5 in H[2]
Controller—CTC controller with color touchscreen[2]
Control features—Multiple PIDs[2]
Uniformity at dwell—+1 / -3.5°C[2]
Recipes—Eight separate recipes with up to 16 ramps and dwells in each recipe[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com
  2. [2]web.archive.orgweb.archive.org