Waferpedia

Comparison ledger

1088versusPB12-2P-CP

Heller 1088, YES PB12-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMHellerYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—12 in.
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088YES PB12-2P-CP
Cited variants—
  • YES PB12-2P-CP[1]
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[2]—
Heating MethodForced convection[2]—
Conveyor Width18 inches (45 cm)[2]—
Heated Length43.5 inches (111 cm)[2]—
Overall Length96 inches (244 cm)[2]—
Height50 inches (127 cm)[2]—
Net Weight900 lbs (409 kg)[2]—
Thermal ProfilerIncluded[2]—
Oven TopCounter balance for easy access to conveyor[2]—
Solder CompatibilityLead-free and leaded soldering[2]—
Model—PB12-2P-CP[1]
Wafer capacity—2 cassettes of 12 in. wafers[1]
Chamber configuration—single compartment[1]
Chamber size—14.5 in. x 21 in. x 27 in. deep chamber[1]
Controller—CTC Controller with Color Touchscreen[1]
Included package—Cooling Package[1]
Chamber dimensions (OEM source)—14.5 in. x 21 in. x 27 in. deep chamber[1]
Chamber dimensions (secondary source)—21 in. barrel x 40.97 in. deep[3]
Maximum temperature—450 °C[1]
Recipe capability—8 recipes with up to 16 ramps and dwells each[1]
N2 flow rate—1 SCFM[3]
Chamber cleanliness—Class One[3]
Electrical requirements—208 V, 3 phase, 30 A, 50/60 Hz[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]smtdevices.comsmtdevices.com
  3. [3]semistarcorp.comsemistarcorp.com