Waferpedia

Comparison ledger

G 4 6400 Deep Accessversus1 WBS 1 Wafer Substrate

F&K Delvotec G 4 6400 Deep Access, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMF&K DelvotecLogitech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyF&K Delvotec G 4 6400 Deep AccessLogitech 1 WBS 1 Wafer Substrate
Specifications
ConfigurationSpare parts included[1]—
ManufacturerF&K Delvotec[1]—
ModelG 4 6400 Deep Access[2]—
Equipment typeBonder[1]—
Asset number78923[2]—
Wafer Size—6 inch[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing