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850 LT SOI Fusion WaferversusSB6 / 8 Gen2

EV Group 850 LT SOI Fusion Wafer, SUSS MicroTec SB6 / 8 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
850 LT SOI Fusion WaferEV Group
SB6 / 8 Gen2SUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryPackaging & BondingPackaging & Bonding
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—Gen2
FamilyEV Group 850SUSS MicroTec SB6 / 8 Gen2
Specifications
ConfigurationFully-Automatic[1]—
Wafer sizeSuitable for wafer sizes up to 8"/200mm wafers[1]up to 200 mm[2]
Automation—Semi-automated[2]
850 LT SOI Fusion Wafer entrySB6 / 8 Gen2 entryAsk about these tools →Share experience with this comparison →

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]hilpert.chhilpert.ch