Waferpedia

Comparison ledger

6200 NTversus1000 Family

EV Group 6200 NT, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6200 NTEV Group
1000 FamilyUltratech
OEMEV GroupUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 6200 NTUltratech 1000 Family
Cited variants
  • EVG6200 NT Gen2[1]
—
Specifications
Voltage200V[2]—
ManufacturerEV Group[3]—
Model6200 NT[3]—
Tool typeBond Aligner[3]Photolithography step-and-repeat 1X stepper[6]
ConfigurationSemi-automated or automated[1]—
Wafer/substrate sizeUp to 200 mm / 8 in[1]—
Exposure sourceMercury light source / UV LED light source[1]—
Exposure source optionsMercury lamp or UV LED lamp source[4]—
Alignment accuracyTop side alignment: ≤ ±0.5 µm; bottom side alignment: ≤ ±1.0 µm; IR alignment: ≤ ±2.0 µm; bond alignment: ≤ ±2.0 µm; NIL alignment: ≤ ±3.0 µm[1]—
ThroughputUp to 180 WPH in first print mode; up to 140 WPH in automatic alignment mode[1]—
Exposure modesVacuum contact / hard contact / soft contact / proximity / curved surface[5]—
System controlWindows-based[5]—
Multi-language user GUI and supportCN, DE, FR, IT, JP, KR[1]—
Additional capabilitiesBond alignment, IR alignment, Nanoimprint lithography (NIL), SmartNIL[1]—
Optical design—Wynne Dyson[6]
Magnification—1X[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]evgroup.comevgroup.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]evgroup.comevgroup.com
  5. [5]instrumenthive.cominstrumenthive.com
  6. [6]en.wikipedia.orgen.wikipedia.org