Waferpedia

Comparison ledger

620 Maskversus1000 Family

EV Group 620 Mask, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
620 MaskEV Group
1000 FamilyUltratech
OEMEV GroupUltratech
CategoryLithographyLithography
Wafer size3 Station Wafer Handler—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 620Ultratech 1000 Family
Specifications
Voltage200 V[1]—
Phase2 Phase[1]—
Configuration50 / 60 Hz[1]—
Current Rating10 A[1]—
Interrupting Capability50 kiloamps[1]—
Overcurrent ProtectionProvided at machine terminals[1]—
Frequency50/60 Hz[2]—
Power consumption1.55 kW[2]—
Full load current rating7.45 A[2]—
Largest current rating7.45 A[2]—
Breaker size / AIC10 A / 10 kA[2]—
Compressed Air (CDA)6 bar / 87 psi[2]—
Nitrogen or CDA6 bar / 87 psi[2]—
Vacuum< 850 mbar / 6460 torr[2]—
Wafer Sizes2, 3, 4, 5, 6, 12 inch[2]—
Backside AlignmentCapable[3]—
Infrared AlignmentCapable[3]—
Chuck Size5 inch to 6 inch[3]—
OEMEV Group[1]—
Model620 Mask[1]—
Equipment typeMask Aligner[1]—
CategoryLithography[1]—
Wafer size4 inch[1]—
Tool type—Photolithography step-and-repeat 1X stepper[5]
Optical design—Wynne Dyson[5]
Magnification—1X[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]en.wikipedia.orgen.wikipedia.org