Comparison ledger
EV Group 101, Nikon NSR S 204 B, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | NSR S 204 BNikon |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Nikon NSR S 204 |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[3] | — |
| Model | 101[3] | NSR S 204 B[6] |
| Equipment name | EVG 101 Spray Coater[3] | — |
| NEMO ID | evgspraycoat[3] | — |
| Training required | EVG 101 Training[3] | — |
| Training duration | 1.50 hours[3] | — |
| Processing technique | Resist Spray Coat (manual)[3] | — |
| Cleanliness | "All"[3] | — |
| Location | SNF Paul G Allen L107 Cleanroom[3] | — |
| Wafer diameter (substrate size) | up to 300 mm[4] | — |
| Available modules | Spin coat / OmniSpray® / develop[4] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[4] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[5] | — |
| Cleanliness group (at SNF) | "All"[3] | — |
| Software Version | — | MCSV[6] |
| CIM | — | SECS[6] |
| Process | — | Photolithography[6] |
| Handler System | — | WL Type 3[6] |
| Factory Interface | — | Open Cassette[6] |
| Configuration | — | Cymer ELS 6400[1] |
| WL Size | — | 200MM[2] |
| Reticle Size | — | 6"[2] |
| RL Type | — | Standard (no smif)[2] |
| NEMA Box | — | 3P 200V[2] |
| Chamber | — | Sendai[2] |
| Lens Type | — | 4EN2GK[2] |
| Chemical Filter | — | Donaldson[2] |
| Online Interface | — | Tel ACT 8 Slow[2] |
| Wafer Size | — | 8 inch[6] |
| Laser | — | Cymer ELS 6400[1] |
| Vintage | — | 2001[1] |
| Variable NA | — | Yes[2] |
| HDD | — | Included[7] |
| Lens Data | — | Available[7] |
| Make | — | Nikon[6] |
| Wafer Sizes | — | 8 inch[6] |
| Features | — | Chip (table) Leveling; In-Line Right; Tel Track; FIA; Pellicle Particle Detector; Variable NA; Microscope Theta; Signal Tower I/F; Online Interface: Tel ACT 8 Slow; MCSV; OCSV; GOCS; Bar Code Reader; MES Software; AIS; Signal Lamp Tower; RPF (random pattern filter)[2] |
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