Comparison ledger
Electroglas EG 4090 Automatic Wafer, Teradyne Ultra Flex, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EG 4090 Automatic WaferElectroglas | Ultra FlexTeradyne |
|---|---|---|
| OEM | Electroglas | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2026 Still in service | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas EG 4090 | Teradyne Ultra Flex |
| Cited variants | — | |
| Specifications | ||
| Configuration | Nickel Chuck[2] | HSD-U (x256):[9] |
| Airblower | IH[2] | — |
| Armsize | IH Bernoulli[2] | — |
| Wafer Size Support | 150 mm and 200 mm wafers[6] | — |
| Chuck Type | Nickel or Gold, hot chuck[2] | — |
| Alignment Accuracy | Micron-level[6] | — |
| Input Voltage | 115VAC[7] | — |
| Vision Module | PRM-3[7] | — |
| Display Control Module | DCM II or DCM-2[7] | — |
| Material Handler Module | Station CONT (ESC) or MHCM[7] | — |
| Prober Control Module | Yes[7] | — |
| Cassette Loader | Yes[7] | — |
| Probing Modes | Manual, semi-automatic, and fully automatic[6] | — |
| Temperature Control | Hot chuck with temperature control (TC2000)[8] | — |
| Thinwafer Support | Yes (listed as option)[2] | — |
| Workstation | — | TERA 3[9] |
| Software | — | V10.10.02[9] |
| Channel | — | 80[9] |
| Software Version | — | V9.10.01[10] |
| HSD-U modules (256 channels each) | — | Qty 3, 768 channels total[9] |
| UVI 80 modules (80 channels each) | — | Qty 1, 80 channels total[9] |
| DC 80 modules (20 channels each) | — | Qty 4, 80 channels total[9] |
| UPAC module (24 channels) | — | Qty 1, 24 channels total[9] |
| Workstation (alternate) | — | TERA 1[10] |
| Software Version (alternate) | — | V9.10.01[10] |
| HSD-U modules (alternate) | — | Qty 3[10] |
| DC 80 modules (alternate, 20 channels each) | — | Qty 2, 40 channels total[10] |
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