Comparison ledger
Disco DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | — |
| Specifications | ||
| DFG 8760 | 3 Axis Dry Polishing Type 2[1] | — |
| Configuration | Z1, Z2 Grinder[1] | — |
| Make | Disco[2] | — |
| Model | DFG 8760 / DFM 2700[2] | — |
| Equipment type | In-Line Wafer Grinder / Lapper / Polisher[2] | — |
| Wafer sizes | 12 inch[1] | — |
| Polishing type | 3 Axis Dry Polishing Type[1] | — |
| Axis / station configuration | Z1, Z2 Grinder - Z3 Polisher[1] | — |
| Includes | Z2 NCG; Auto Label Printer; Dicing Tape Pre-Cut Unit; HDD & Software[1] | — |
| Vintage | 2006[1] | — |
| Outside plate diameter | — | 12 inches[3] |
| Lapping Speed Range | — | 0 to 60 rpm[4] |
| Wafer Size Compatibility | — | 4 inches or smaller[3] |
| Input Voltage | — | 110 V[3] |
| Frequency | — | 60 Hz[3] |
| Phase | — | 1[3] |
| Number of Rings | — | 3[3] |
| Number of Weights | — | 3[3] |
| Includes Slurry System | — | Yes[3] |
| Includes Timer | — | Yes[3] |