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Comparison ledger

DAD641versus15

Disco DAD641, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DAD641Disco
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAD641Lapmaster 15
Specifications
Tool typeDicing saw[1]—
LocationBackend Lab[1]—
Tool nameDisco DAD641[2]—
Blade thickness options0.250 mm and 0.090 mm[3]—
Tape thickness options130 μm (blue tape) and 160 μm (UV tape)[3]—
Substrate dicing capability5×5 mm2 pieces[4]—
Input Power—110 Vac[5]
Plate Diameter—15 inches (381 mm)[6]
Number of Conditioning Rings—3[6]
Ring ID—5.5 inches (140 mm)[6]
Standard RPM—60[6]
RPM Range (Variable Speed Drive)—0-60[6]
Drive Motor - Lapper—0.5 HP (0.37 kW)[6]
Drive Motor - Polisher—0.75 HP (0.56 kW)[6]
Length—25 inches (635 mm)[6]
Width—20 inches (508 mm)[6]
Height—24 inches (610 mm)[6]
Estimated Shipping Weight—285 lbs (129.3 kg)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]arxiv.orgarxiv.org
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org