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Comparison ledger

3220versusDGP 8761 + DFM 2800 In-Line

Disco 3220, Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DGP 8761
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Configuration—Fully Automatic[3]
Make—Disco[3]
Model—DGP 8761 + DFM 2800 In-Line[3]
Machine type—In-Line Grinder[3]
Automation—Fully automatic[3]
Axis—3 Axis[3]
Chuck table—200 mm/300 mm universal (orientation flat)[3]
Spinner table—200 mm/300 mm universal (orientation flat)[3]
Robot pick—Inline dedicated (200 mm/300 mm wafers dedicated)[3]
Foup opener unit—300 mm wafers dedicated (with 200 mm adapter)[3]
Host communication—SECS-1/-2 and GEM compliant[3]
Vintage—2012 Vintage[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing