Comparison ledger
Disco 3220, Disco DFG 8830, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DFG 8830Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFG |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Configuration | — | In-Feed[3] |
| Phase | — | 3 Phase[3] |
| Wafer size | — | 6 inch, 8 inch[3] |
| Material | — | SiC (silicon carbide)[3] |
| Max workpiece size | — | ø150 mm[4] |
| Spindle quantity | — | 4[4] |
| Spindle power (Z1–Z3) | — | 6.3 kW[4] |
| Spindle speed (Z1–Z3) | — | 1,000–4,000 min⁻¹[4] |
| Work disc quantity | — | 5[4] |
| Dimensions (W×D×H) | — | 1,400 × 2,500 × 2,000 mm[4] |
| Weight | — | ≈6,000 kg[4] |
| Maximum workpiece size | — | 150 mm (6 inch)[4] |
| Wafer sizes supported | — | 6 inch and 8 inch[3] |
| Spindle count | — | 4[4] |
| Spindle speed range | — | 1,000 – 4,000 min⁻¹[4] |
| Number of work stations | — | 5[4] |
| Dimensions (W x D x H) | — | 1,400 x 2,500 x 2,000 mm[4] |
| Material compatibility | — | SiC[3] |
| In-feed capability | — | Yes[3] |
| Power supply | — | 3 Phase, 3 Wire + Ground, 60 A[3] |
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