Waferpedia

Comparison ledger

3220versusDFD 6341 Fully Automatic Dicing

Disco 3220, Disco DFD 6341 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DFD 6341 Fully Automatic Dicing
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Max workpiece size—Φ8 inch[3]
X-axis Cutting range—210 mm[3]
Cutting speed—0.1 to 1,000 mm/s[3]
Y1・Y2-axis Cutting range—210 mm[3]
Index step—0.0001 mm[3]
Positioning accuracy—Within 0.002/210 (Single error), Within 0.002/5[3]
Z-axis Max stroke—19.22 mm (for Φ2 inch blade), 19.9 mm (for Φ3 inch blade)[3]
Z-axis Moving resolution—0.00005 mm[3]
Z-axis Repeatability accuracy—0.001 mm[3]
θ-axis Max rotating angle—380 deg[3]
Spindle rated torque—0.19 N·m (1.2 kW/High speed rotation), 0.29 N·m (1.8 kW), 0.7 N·m (2.2 kW?)[3]
Spindle rotation speed range—6,000 – 60,000 min⁻¹ (1.2 kW/1.8 kW), 20,000 – 80,000 min⁻¹ (High speed rotation), 3,000 – 30,000 min⁻¹ (2.2 kW?)[3]
Equipment dimensions (W×D×H)—1,180 × 1,080 × 1,820 mm[3]
Equipment weight—Approx. 1,500 kg[3]
Optional high-speed flash alignment speed—600 mm/s[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]disco.com.sgdisco.com.sg