Waferpedia

Comparison ledger

3220versusDAD 340 Automatic Dicing

Disco 3220, Disco DAD 340 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DAD 340
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Configuration—Not operational[3]
Make—Disco[3]
Model—DAD 340[3]
Equipment type—Automatic Dicing Saw[3]
Wafer size—8 inch[3]
Operating status—Not operational[3]
Known issue—Y-X Axis of Chuck are Out of Order[3]
Feature—Up to 8" wafers[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]gtsaz.comgtsaz.com