Waferpedia

Comparison ledger

03 iX AutomaticversusNXT H Placement

Dek 03 iX Automatic, Fuji NXT H Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDekFuji
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticFuji NXT
Specifications
Vintage2020[1]—
Configuration—H02 Head[2]
Head type—H02 Head[2]
Maximum chip size—60mm x 60mm[2]
Placement capabilities—High density, low impact, semiconductor[3]
Feeding methods—Wafer and reel part placement, direct pickup from wafers[3]
Drive system—Linear motor movement[3]
Alignment system—High-resolution cameras[3]
Cleanroom class—Class 1000[3]
User interface—15-inch touchscreen panel[3]
XY robot cleanroom capability—Cleanroom capable; HEPA filter option available[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]smt.fuji.co.jpsmt.fuji.co.jp