Waferpedia

Comparison ledger

03 iX Automaticversus2Di

Dek 03 iX Automatic, DEK 2Di, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2DiDEK
OEMDekDEK
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticDEK 2Di
Specifications
Vintage2020[1]—
inspection type—built-in 2-dimensional inspection system[2]
stencil inspection—detects blocked apertures and underside smearing[2]
board inspection—verifies correct paste location, alignment, and bridge detection[2]
camera system—coaxial look-up/look-down camera system[2]
lighting—advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[2]
optics—telecentric lenses[2]
repeatability—3-sigma repeatability[2]
board inspection repeatability—better than 5% 3-sigma repeatability in tests carried out by DEK[2]
processing time—0.2 s per site[2]
inspection mode—OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[2]
automation—selectable-mode automatic stencil cleaning cycle and alert mode[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.orgweb.archive.org