Comparison ledger
CEE 1000 Hot Plate, YES 310TA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 310TAYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | up to 6-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | YES 310TA |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 4"[2] | — |
| Type | Hot Plate[2] | — |
| Wafer Size | 4 inch[2] | — |
| Model | — | 310TA[3] |
| Equipment type | — | HMDS Vapor Prime Oven[3] |
| Description | — | Vacuum cure & HMDS vapor prime oven[4] |
| Priming agent | — | HMDS in vapor phase[4] |
| Process temperature | — | 150 °C[4] |
| Exposure time | — | 300 s[4] |
| Total process time including purges | — | ~15 min[4] |
| Carrier capacity | — | 25 slots for 4-inch or 6-inch wafers per cassette[4] |
| Wafer compatibility | — | up to 6-inch wafers[4] |
| Process type | — | HMDS vapor priming[4] |
| Temperature | — | 150 °C[4] |
| Total process time | — | ~15 min[4] |
| Wafer capacity | — | 25 slots for 4″ or 6″ wafers[4] |
| Maximum wafer size | — | up to 6-inch[3] |
| HMDS exposure time | — | 300 seconds[4] |
| Wafer size capacity | — | up to 6-inch[3] |
| Cassette capacity | — | 25 slots for 4" or 6" wafers[4] |
| Wafer size | — | up to 6-inch wafers[3] |
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