Comparison ledger
CEE 1000 Hot Plate, Ultratech LSA100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LSA100Ultratech | |
|---|---|---|
| OEM | CEE | Ultratech |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | 65 nm |
| Introduced | — | 2004 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2004 Introduction on Unity Platform |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Ultratech LSA100 |
| Specifications | ||
| Configuration | 4"[1] | — |
| Type | Hot Plate[1] | annealing system[2] |
| Wafer Size | 4 inch[1] | — |
| Process | — | Laser Processing laser spike annealing[2] |
| Platform | — | Unity Platform[2] |
| Introduction | — | mid-2004[2] |
| Node association | — | beyond the 65-nm node[2] |
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