Waferpedia

Comparison ledger

49 7211versus12 Lapper

Buehler 49 7211, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
49 7211Buehler
12 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler 49 7211—
Specifications
Phase1 Phase[1]1[3]
Configuration170-264 Vac[1]—
Tool typeChemical mechanical polisher (CMP)[1]—
Electrical phases1 phase[1]—
Input voltage170-264 Vac[1]—
Frequency47/63 Hz[1]60 Hz[3]
CategoryCMP[2]—
Outside plate diameter—12 inches[3]
Lapping Speed Range—0 to 60 rpm[4]
Wafer Size Compatibility—4 inches or smaller[3]
Input Voltage—110 V[3]
Number of Rings—3[3]
Number of Weights—3[3]
Includes Slurry System—Yes[3]
Includes Timer—Yes[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]jmind.comjmind.com
  4. [4]etd.ohiolink.eduetd.ohiolink.edu