Waferpedia

Comparison ledger

017-0024-01 Prealignerversus6200 NT Semi Automated Bottom Side Alignment

Brooks 017-0024-01 Prealigner, EV Group 6200 NT Semi Automated Bottom Side Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBrooksEV Group
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0024-01 PrealignerEV Group 6200
Specifications
Configuration—Double side[1]
Exposure Modes—Hard, Soft, & Vacuum Contact[1]
Separation Distance—0 - 300 µm adjustable via software[1]
Wafer Thickness—0.1 - 10 mm (For Top Side)[1]
OEM—EV Group[1]
Model—6200 NT Semi Automated Bottom Side Alignment[1]
Tool type—Mask alignment system[2]
Lithography use—Optical double-side lithography[2]
Wafer/substrate size—Up to 200 mm / 8 inch[2]
Bottom side alignment—≤ ± 1.0 µm[2]
Top side alignment—≤ ± 0.5 µm[2]
Exposure source—Mercury light source / UV LED light source[2]
Exposure setup—Vacuum contact / hard contact / soft contact / proximity mode / flex mode[2]
Throughput—Up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode[2]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]evgroup.comevgroup.com