Waferpedia

Comparison ledger

0 V 500versus310TA

Blue M 0 V 500, YES 310TA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0 V 500Blue M
OEMBlue MYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—up to 6-inch wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M 0 V 500YES 310TA
Cited variants—
Specifications
Model—310TA[2]
Equipment type—HMDS Vapor Prime Oven[2]
Description—Vacuum cure & HMDS vapor prime oven[3]
Priming agent—HMDS in vapor phase[3]
Process temperature—150 °C[3]
Exposure time—300 s[3]
Total process time including purges—~15 min[3]
Carrier capacity—25 slots for 4-inch or 6-inch wafers per cassette[3]
Wafer compatibility—up to 6-inch wafers[3]
Process type—HMDS vapor priming[3]
Temperature—150 °C[3]
Total process time—~15 min[3]
Wafer capacity—25 slots for 4″ or 6″ wafers[3]
Maximum wafer size—up to 6-inch[2]
HMDS exposure time—300 seconds[3]
Wafer size capacity—up to 6-inch[2]
Cassette capacity—25 slots for 4" or 6" wafers[3]
Wafer size—up to 6-inch wafers[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]colorado.educolorado.edu
  3. [3]epfl.chepfl.ch