Comparison ledger
Blue M 0 V 500, Tystar Mini Tytan 4600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0 V 500Blue M | Mini Tytan 4600Tystar |
|---|---|---|
| OEM | Blue M | Tystar |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 50mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blue M 0 V 500 | Tystar Mini Tytan 4600 |
| Specifications | ||
| Furnace stack tubes | — | Four vacuum tubes in one furnace stack[1] |
| Atmospheric pressure tubes | — | Two[1] |
| Low-pressure tubes | — | Two[1] |
| Maximum temperature for silicon nitride | — | Up to 850 °C[1] |
| Maximum temperature for all others | — | Up to 650 °C[1] |
| Maximum deposition thickness | — | 5 µm[1] |
| Low temperature oxidation | — | For processes of < 450 °C[1] |
| Mass flow system | — | MFS-460[1] |
| Data collection system | — | DCS-30[1] |
| Wafer Size | — | up to 150 mm (6 inch)[1] |
| Maximum Temperature (Silicon Nitride) | — | 850 °C[1] |
| Maximum Temperature (Other Processes) | — | 650 °C[1] |
| Low Temperature Oxidation Temperature | — | < 450 °C[1] |
| Number of Tubes | — | 4 (2 atmospheric, 2 low-pressure)[1] |
| LPCVD Processing Status | — | Currently not available[1] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →