Waferpedia

Comparison ledger

0 500versusMini Tytan 4600

Blue M 0 500, Tystar Mini Tytan 4600, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0 500Blue M
OEMBlue MTystar
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—50mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M 0 500Tystar Mini Tytan 4600
Specifications
ManufacturerBlue M[1]—
Model0 500[1]—
Asset number139866[1]—
Last confirm dateSeptember 10, 2025[1]—
Equipment typeOven[1]—
Furnace stack tubes—Four vacuum tubes in one furnace stack[2]
Atmospheric pressure tubes—Two[2]
Low-pressure tubes—Two[2]
Maximum temperature for silicon nitride—Up to 850 °C[2]
Maximum temperature for all others—Up to 650 °C[2]
Maximum deposition thickness—5 µm[2]
Low temperature oxidation—For processes of < 450 °C[2]
Mass flow system—MFS-460[2]
Data collection system—DCS-30[2]
Wafer Size—up to 150 mm (6 inch)[2]
Maximum Temperature (Silicon Nitride)—850 °C[2]
Maximum Temperature (Other Processes)—650 °C[2]
Low Temperature Oxidation Temperature—< 450 °C[2]
Number of Tubes—4 (2 atmospheric, 2 low-pressure)[2]
LPCVD Processing Status—Currently not available[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]pnf.uchicago.edupnf.uchicago.edu