Waferpedia

Comparison ledger

22 AD 42versus501

Blanchard 22 AD 42, EV Group 501, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
501EV Group
OEMBlanchardEV Group
CategoryDicing & GrindingDicing & Grinding
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42EV Group 501
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]—
Equipment name—EVG 501 Wafer Bonder[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu