Waferpedia

Comparison ledger

22 AD 42versusDTG 8460 Wafer Backside

Blanchard 22 AD 42, Disco DTG 8460 Wafer Backside, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DTG 8460
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]Includes DTU 1550[2]
Chuck table for 12—, and 8" is possible[2]
Each spindle has 2 height gauge—inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[2]
Machine type—Wafer backside grinder[2]
Wafer size—12 inch[2]
Accessory—Includes DTU 1550[2]
Chuck table—For 12", and 8" is possible[2]
Robot picker—For 12", and 8" is possible[2]
Spinner table—For 12", and 8" is possible[2]
Height gauge—Each spindle has 2 height gauge: inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing