Waferpedia

Comparison ledger

20 36 SurfaceversusDS 266

Blanchard 20 36 Surface, Meyer Burger DS 266, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
DS 266Meyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceMeyer Burger DS 266
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]120A[2]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Voltage—400V[2]
Frequency—50 Hz[2]
Current—120 A[2]
Vintage—2008[2]
Wafer Size—8 inch[3]
Includes HDD & Software—Yes[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing