Waferpedia

Comparison ledger

20 36 SurfaceversusDAD3241

Blanchard 20 36 Surface, Disco DAD3241, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
DAD3241Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DAD3241
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Max. workpiece size—Φ8”[2]
X-/Y-axis cutting range—210 mm[2]
Cutting speed—0.1-800 mm/s[2]
Index positioning accuracy—0.002/210 mm[2]
Z-axis max. stroke—32.2 mm[2]
Moving resolution—0.000002 mm[2]
Repeatability accuracy—0.001 mm[2]
Θ-axis max. rotating angle—320°[2]
Rotation speed range—6,000-60,000 rpm[2]
X-axis cutting range—210 mm[2]
Y-axis cutting range—210 mm[2]
Spindle rated output—1.8 kW at 60,000 min-1[4]
Spindle rated torque—0.29 N·m[4]
Equipment dimensions—650 × 950 × 1,670 mm[4]
Equipment weight—Approx. 550 kg[4]
Axis drive—Servo motors on all axes (X, Y, and Z)[3]
Interface—XIS (Extended Interface System)[3]
Microscope—Built-in microscope[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu
  3. [3]disco.com.sgdisco.com.sg
  4. [4]disco.co.jpdisco.co.jp