Waferpedia

Comparison ledger

18 D SurfaceversusTS 23 ID

Blanchard 18 D Surface, Meyer Burger TS 23 ID, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
TS 23 IDMeyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceMeyer Burger TS 23 ID
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]Meyer Burger[4]
Model18 D[1]TS 23[4]
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—Refurbished in 2020[3]
Equipment type—ID Saw[4]
Vintage (one unit)—1985[3]
Refurbished (one unit)—Refurbished in 2020[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing