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Comparison ledger

18 D Surfaceversus782-6

Blanchard 18 D Surface, Kulicke & Soffa 782-6, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
782-6Kulicke & Soffa
OEMBlanchardKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size—6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceKulicke & Soffa 782-6
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Maximum wafer size—up to 6" wafers[3]
Maximum wafer thickness—800 µm thick[3]
Materials diced—Si, Glass, Quartz, SiC, Sapphire, LiNbO3[3]
Kerf width—down to 50 µm (blade dependent)[3]
Blade cooling and rinsing—DI water[3]
Category—Dicing & Grinding[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  4. [4]waferpedia.comwaferpedia.com