Waferpedia

Comparison ledger

18 D SurfaceversusDTG 8460 Taiko

Blanchard 18 D Surface, Disco DTG 8460 Taiko, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DTG 8460
Cited variants—
  • DTG 8460 Wafer Backside[1]
Specifications
Voltage416 V[2]208 V[5]
Phase3 Phase[2]200-2008 V, 50 A, 50/60 Hz, 3 Phase[4]
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[2]—
Power416 V, 3 phase[2]—
Configuration—3 Chucks[4]
Wafer size—12 inch[4]
Process type—Cassette to Cassette[4]
Number of chucks—3[4]
Current—50 A[4]
Frequency—50/60 Hz[4]
Add-on chiller—DTU 1531[4]
Accessories—USV, Duct Unit, Vacuum Unit[4]
Vintage year—2012[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]tarasemi.comtarasemi.com