Waferpedia

Comparison ledger

18 D SurfaceversusDGP 8761 + DFM 2800 In-Line

Blanchard 18 D Surface, Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DGP 8761
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]Disco[3]
Model18 D[1]DGP 8761 + DFM 2800 In-Line[3]
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—Fully Automatic[3]
Machine type—In-Line Grinder[3]
Automation—Fully automatic[3]
Axis—3 Axis[3]
Chuck table—200 mm/300 mm universal (orientation flat)[3]
Spinner table—200 mm/300 mm universal (orientation flat)[3]
Robot pick—Inline dedicated (200 mm/300 mm wafers dedicated)[3]
Foup opener unit—300 mm wafers dedicated (with 200 mm adapter)[3]
Host communication—SECS-1/-2 and GEM compliant[3]
Vintage—2012 Vintage[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing