Comparison ledger
Besi DS 9000 E, Kulicke & Soffa IBond 5000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DS 9000 EBesi | IBond 5000Kulicke & Soffa |
|---|---|---|
| OEM | Besi | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi DS 9000 E | Kulicke & Soffa IBond 5000 |
| Cited variants | — | |
| Specifications | ||
| Voltage | 208 VAC[3] | — |
| Configuration | Single Phase[1] | Ball-wedge bonding capability[5] |
| Phase | 1 Phase[4] | — |
| Make | Besi / Datacon[1] | K&S[6] |
| Model | DS 9000 E[1] | IBond 5000[6] |
| Tool type | Bonder[1] | — |
| Wafer size | 8 inch[1] | — |
| Frequency | 50/60 Hz[3] | — |
| Current | 10 Amps[3] | — |
| Spool Size | — | Ball bonding 2" x 1" double flange spool[5] |
| Bonding Area | — | 135 x 135 mm (5.3 x 5,3 ")[5] |
| Throat Depth | — | 143 mm (5.6")[5] |
| Gross Table Motion | — | 14 mm (o.55")[5] |
| Bonding capability | — | Ball-wedge[5] |
| Power supply | — | 100-240 V, 50/60 Hz[5] |
| Wire feed angle | — | 90 degrees, vertical feed[5] |
| Spool size (ball bonding) | — | 2" x 1" double flange spool[5] |
| Gold wire diameter | — | 0.7 mil to 3.0 mil (17 to 75 microns)[5] |
| Copper wire diameter | — | 0.7 mil to 2 mil (12 to 50 microns)[5] |
| Bonding tool capillary lengths | — | 0.375", 0.437", 0.625"[5] |
| Bonding area (XY table) | — | 135 x 135 mm (5.3 x 5.3 inches)[5] |
| Throat depth | — | 143 mm (5.6 inches)[5] |
| Gross table motion | — | 14 mm (0.55 inches)[5] |
| Fine table motion | — | 14 mm (0.55 inches)[5] |
| Mouse ratio | — | 6:1[5] |
| Motorized Y setback | — | up to 4 mm (160 mil)[5] |
| Motorized Y reverse | — | up to 0.25" (10 mil)[5] |
| Motorized Y kink height | — | up to 0.5 mm (20 mil)[5] |
| Z axis travel | — | 0.500" (12.5 mm)[5] |
| Ultrasonic transducer frequency | — | 60 kHz[5] |
| Ultrasonic generator | — | Phase Lock Loop self-tuning[5] |
| Low ultrasonic power | — | 1.3 watts[5] |
| High ultrasonic power | — | 2.5 watts[5] |
| Bond time range | — | 10-1000 milliseconds (selectable ranges 10-100 ms and 10-1000 ms)[5] |
| Bond force range | — | 10-250 grams (requires added weights >80 grams), force coil range 3-80 grams[5] |
| Wire termination | — | Programmable tail pull for ball bonding[5] |
| Temperature control range | — | up to 250°C, +/-5°C[5] |
| Fine Table Motion | — | 14 mm (0.55")[5] |
| Equipment type | — | Wire bonder[6] |
| Input power | — | 100-240 V, 50/60 Hz[5] |
| Ball bonding capillary lengths | — | 0.375", 0.437", 0.625"[5] |
| Ultrasonic system | — | High Q 60kHz K&S transducer[5] |
| Temperature control | — | Built-in; range up to 250 C, +/- 5 C[5] |
| Vintage | — | 2021[7] |
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