Comparison ledger
Axcelis Purion H 200 High Current, Varian 160 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Purion H 200 High CurrentAxcelis | 160 XPVarian |
|---|---|---|
| OEM | Axcelis | Varian |
| Category | Ion Implantation | Ion Implantation |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis Purion H 200 High Current | Varian 160 XP |
| Cited variants | — |
|
| Specifications | ||
| Manufacturer | Axcelis[2] | — |
| Model | Purion H 200[2] | — |
| Tool type | High Current Implanter[2] | — |
| Wafer size | 12 inch[2] | — |
| Tool description | single wafer high current implanter[3] | — |
| Maximum single charge energy range | up to 230 keV[3] | — |
| Maximum accel voltage | 170 kV[3] | — |
| High-current beamline capability | greater than 20 mA of beam currents[3] | — |
| Wafer sizes | 12 inch; 6 inch; 200 mm; 150 mm; 300 mm[3] | — |
| Configuration (160 XP Ion variant) | — | 150mm High Current IMP[1] |
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