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Comparison ledger

200 PCUversusKestrel II 750

Axcelis 200 PCU, Varian Kestrel II 750, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size—10 Site Disk, 10 Wafer per Batch
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Varian Kestrel II 750
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]30 kV Terminal PS[5]
Configuration—High current[4]
Energy Range—10 - 3750 kV[5]
Wafer size—10 Site Disk, 10 Wafer per Batch[6]
Wafer Size—8 inch[4]
Batch Size—10 Wafers per Batch[5]
Disk Sites—10 Site Disk[5]
Gas Modules—4 Gas Modules[5]
Gases—Argon (factory inlet), PH3 SDS, AsH3 SDS, BF3 SDS[5]
Automatic Handling—Yes[5]
Software Version—6.41[6]
High Current—Yes[6]
Power Supply Interface (PSI) Controller—Included[6]
Source Vacuum Controller—Included[6]
Manipulator Controller—Included[6]
30 kV Terminal PS—Included[6]
60 kV Tube Lens PS—Included[6]
Category—Ion Implantation[6]
Handling system—Automatic Handling system[5]
Gas box—Fully Automated Gas Box, 4 Gas Modules[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com