Waferpedia

Comparison ledger

200 ACUversusNE 950 ICP-RIE

Axcelis 200 ACU, Ulvac NE 950 ICP-RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisUlvac
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Ulvac NE 950
Specifications
ConfigurationParts Machine[1]Gas Box:[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Gas 1 Horiba STEC SEC-E40 Ar—100SCCM[5]
Gas 2 Horiba STEC SEC-E40 O2—100SCCM[5]
Gas 3 Horiba STEC SEC-E40 CHF3—100SCCM[5]
Cooling Gas—MKS 649A 50SCCM[5]
Match Box 1—AMV-1000-12.5M-CT[5]
Match Box 2—AMV-1000-AV3[5]
Valve—MKS T3PIA 26696[5]
Gauge—MKS E28D[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing