Waferpedia

Comparison ledger

200 ACUversusMultiplex ICP Advanced Oxide

Axcelis 200 ACU, STS Multiplex ICP Advanced Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200STS Multiplex ICP
Specifications
ConfigurationParts Machine[1]80 A[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Voltage—208 V[5]
Frequency—60 Hz[5]
RF Generators—ENI ACG10B 1kW (13.56MHz)[5]
Clamp Type—Standard WTC[5]
Platen Type—Domed[5]
Turbo Pump—None[5]
MACs Robot—None[5]
Pumping System—None[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing