Waferpedia

Comparison ledger

200 ACUversusAdvanced Silicon DRIE

Axcelis 200 ACU, STS Advanced Silicon DRIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200STS Advanced Silicon DRIE
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com