Waferpedia

Comparison ledger

200 ACUversusPlasmalab 100 RIE

Axcelis 200 ACU, Oxford Instruments Plasmalab 100 RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Plasmalab 100 RIEOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Oxford Instruments Plasmalab 100
Cited variants—
  • Plasmalab 100 Plus[1]
  • Plasmalab 100 RIE (FL)[2]
Specifications
ConfigurationParts Machine[3]With VAT PM-5 Adaptive Pressure Controller[7]
ManufacturerAxcelis[3]—
Model200 ACU[3]—
Tool typeAsher[3]—
Wafer size200mm[5]—
Serial numberAU6A356AH[5]—
Computer systemM 200 PC, M 200[6]—
Part numberSC 4572 A[6]—
Volts208[6]—
Amps30[6]—
Equipment typeAsher[3]—
Wafer configuration8 inch[4]—
Voltage—208V, 50/60Hz[7]
Wafer Size—6 inch[7]
RF Generator—Advanced Energy RFX 600A, 600 W @ 13.56 MHz[2]
Electrode Temperature Range—10°C to 80°C[2]
Turbo Pump—Alcatel ATH 400M[2]
Turbo Pump Controller—Alcatel ACT 600M[2]
Pressure Controller—VAT PM-5 Adaptive Pressure Controller[7]
Number of Gas Lines—6 (with MFCs)[2]
Installed Gases—Ar, N2, CHF3, NF3, N2O[2]
Chiller—Thermo Neslab RTE7 Chiller and OptiTemp OTI-5WL-P3-216 Chiller[7]
Vacuum Pump—Leybold D65BCS Vacuum Pump with oil filter and exhaust filter[7]
Control System—Windows PC with user-friendly interface and blue PLC control architecture[2]
Platen Size—330 mm platen[2]
Load-locked—Yes[1]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]classoneequipment.comclassoneequipment.com
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com
  7. [7]inventory listing