Waferpedia

Comparison ledger

200 ACUversusPlasmalab 100 Plus RIE

Axcelis 200 ACU, Oxford Instruments Plasmalab 100 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Plasmalab 100 Plus RIEOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Oxford Instruments Plasmalab 100
Specifications
ConfigurationParts Machine[1]Load-locked System[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]Reactive ion etcher[5]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Category—Etch[6]
Wafer sizes—2, 3, 4, 5, 6, 8, 12 inch[5]
System configuration—Load-locked system[5]
Gas module—Currently set up for Ar, O2, Cl2, and SiCl4; capable of 6 gases[5]
Included items—Computer, keyboard, new flat panel monitor, system chiller, turbo pump, load lock pump, operations manual and documentation[5]
Condition—Fully refurbished and meeting original specifications[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com