Waferpedia

Comparison ledger

200 ACUversus80-etch

Axcelis 200 ACU, Oxford Instruments 80-etch, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
80-etchOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Oxford Instruments 80-etch
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]80-etch[5]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]9M69591A[5]
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
OEM—Oxford Instruments[5]
S/N—9M69591A[5]
Controller arrangement—One controller for both RIE and PECVD[5]
PECVD capabilities—Amorphous Si, Si3N4, SiONx, SiO2[5]
Source gases available—SiH4, N2, N2O, NH3, Ar[5]
Category—Etch[6]
Process use—Wafer or thin film etching/patterning[5]
Source gases—SiH4, N2, N2O, NH3, Ar[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]nanofab.utah.edunanofab.utah.edu
  6. [6]waferpedia.comwaferpedia.com