Waferpedia

Comparison ledger

200 ACUversusTCP 9400 SE

Axcelis 200 ACU, Lam Research TCP 9400 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
TCP 9400 SELam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research TCP 9400 SE
Cited variants—
  • 9400 SE (Model 9408)[1]
  • TCP 9400 SE (150 mm configuration)[2]
Specifications
ConfigurationParts Machine[3]—
ManufacturerAxcelis[3]—
Model200 ACU[3]—
Tool typeAsher[3]—
Wafer size200mm[5]200 mm (8 inch)[7]
Serial numberAU6A356AH[5]—
Computer systemM 200 PC, M 200[6]—
Part numberSC 4572 A[6]—
Volts208[6]—
Amps30[6]—
Equipment typeAsher[3]—
Wafer configuration8 inch[4]—
Software Revision—E1.6.1-002[7]
Main UI PN—PC NEXT 33[7]
ESC—718-094523-281[7]
Liner—715-030329-002[7]
GAZ Box Réf—853-024403-104[7]
Platform—Rainbow[8]
Source type—Inductively coupled (TCP)[8]
Chamber configuration—Single chamber[8]
Wafer transport—Cassette to cassette[8]
Vacuum pump—Leybold TURBOVAC 1000C[1]
Software version—Envision version 1.4[1]
End point detection—Emission and interferometric[8]
Ceramic free chamber—Yes[1]
Waferless auto clean (WAC)—Yes[1]
CE Certified—Yes[1]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (8)Every fact above is drawn from these public sources
  1. [1]photonicmicrodevices.comphotonicmicrodevices.com
  2. [2]wotol.comwotol.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com
  7. [7]inventory listing
  8. [8]photonicmicrodevices.comphotonicmicrodevices.com