Waferpedia

Comparison ledger

200 ACUversusFlex Expl Dry

Axcelis 200 ACU, Lam Research Flex Expl Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Flex Expl DryLam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research Flex Expl Dry
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]Lam Research[5]
Model200 ACU[1]Flex Expl[6]
Tool typeAsher[1]Dry etcher[6]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Category—Etch[5]
Tool name—Flex Expl Dry[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]waferpedia.comwaferpedia.com
  6. [6]Equipment inventory listing