Waferpedia

Comparison ledger

200 ACUversus2300 Exelan Flex Dielectric

Axcelis 200 ACU, Lam Research 2300 Exelan Flex Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300 Exelan Flex Dielectric
Cited variants—
  • 2300 Exelan HP (High Productivity)[1]
  • Exelan Classic (pre-2005)[1]
Specifications
ConfigurationParts Machine[2]—
ManufacturerAxcelis[2]—
Model200 ACU[2]—
Tool typeAsher[2]—
Wafer size200mm[4]300mm[6]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
ICP source frequency—13.56MHz for Exelan HP; 60MHz for Flex variant[1]
Max ICP power (HP variant)—3000W[1]
Technology node—sub-65nm for Flex variant; 90nm for HP variant[1]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]caladansemi.comcaladansemi.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]fabsurplus.comfabsurplus.com