Waferpedia

Comparison ledger

17099370 Outer strike plateversusE 500 EHP

Axcelis 17099370 Outer strike plate, Varian E 500 EHP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
E 500 EHPVarian
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis 17099370 Outer strike plateVarian E 500 EHP
Specifications
ConfigurationUsed with Axcelis GSD 200[1]—
Voltage—208 V[2]
Frequency—50 Hz[3]
Phase—3 Phase[2]
Category—Ion Implantation[4]
Implanter type—Medium current implanter[5]
Maximum beam energy—250 kV[2]
Wire configuration—5 Wire[2]
Wafer size—6"[2]
Convertible to 8"—Yes[5]
Thin wafer handling kit—Included[5]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]waferpedia.comwaferpedia.com