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Comparison ledger

TWINSCAN NXE:3600Dversus101

ASML TWINSCAN NXE:3600D, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMASMLEV Group
CategoryLithographyLithography
Wafer size——
Process node5 nm, 3 nm—
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML TWINSCAN NXE:3600DEV Group 101
Specifications
Wavelength13.5 nm[1]—
Numerical Aperture (NA)0.33[1]—
Resolution13 nm[1]—
OEM—EV Group[2]
Model—101[2]
Equipment name—EVG 101 Spray Coater[2]
NEMO ID—evgspraycoat[2]
Training required—EVG 101 Training[2]
Training duration—1.50 hours[2]
Processing technique—Resist Spray Coat (manual)[2]
Cleanliness—"All"[2]
Location—SNF Paul G Allen L107 Cleanroom[2]
Wafer diameter (substrate size)—up to 300 mm[3]
Available modules—Spin coat / OmniSpray® / develop[3]
Wafer handling options—Bowed / warped / thin wafer handling, edge handling[3]
Dispense options—Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3]
Processing technique (at SNF)—Resist Spray Coat (manual)[4]
Cleanliness group (at SNF)—"All"[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]asml.comasml.com
  2. [2]snfguide.stanford.edusnfguide.stanford.edu
  3. [3]evgroup.comevgroup.com
  4. [4]snfguide.stanford.edusnfguide.stanford.edu