Comparison ledger
ASML TWINSCAN EXE:5000, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | 2023 | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2023 First delivery · 2023 First in new generation · 2025 Planned high-volume support | — |
| Control system | — | — |
| Generation | High NA | — |
| Family | ASML TWINSCAN EXE:5000 | EV Group 101 |
| Cited variants |
| — |
| Specifications | ||
| Light source wavelength | 13.5 nm[1] | — |
| Numerical aperture (NA) | 0.55[1] | — |
| Resolution | 8 nm[1] | — |
| Stage type | Dual-stage[1] | — |
| Technology generation | High NA EUV[1] | — |
| Technology | Extreme ultraviolet (EUV) lithography[1] | — |
| Platform | EXE (High NA EUV)[1] | — |
| OEM | — | EV Group[2] |
| Model | — | 101[2] |
| Equipment name | — | EVG 101 Spray Coater[2] |
| NEMO ID | — | evgspraycoat[2] |
| Training required | — | EVG 101 Training[2] |
| Training duration | — | 1.50 hours[2] |
| Processing technique | — | Resist Spray Coat (manual)[2] |
| Cleanliness | — | "All"[2] |
| Location | — | SNF Paul G Allen L107 Cleanroom[2] |
| Wafer diameter (substrate size) | — | up to 300 mm[3] |
| Available modules | — | Spin coat / OmniSpray® / develop[3] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[3] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[4] |
| Cleanliness group (at SNF) | — | "All"[2] |
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