Comparison ledger
ASM AB 559 A 06 Wedge, Hesse & Knipps BJ 820 V 1 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BJ 820 V 1 WedgeHesse & Knipps | |
|---|---|---|
| OEM | ASM | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AB 559 | Hesse & Knipps BJ 820 |
| Specifications | ||
| Configuration | 50/60 Hz[1] | 45* Bond Head[3] |
| Software vs | 2.42[2] | — |
| Machine type | Wedge Bonder[1] | — |
| Make | ASM[1] | — |
| Model | AB 559 A 06[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Voltage | 240 Volts[1] | — |
| Vintage | 2005[1] | — |
| Software version | 2.42[2] | — |
| Bond head angle | — | 45°[3] |
| Fine wire maximum | — | 2.7 mils[3] |
| Software | — | Latest installed[3] |
| Detachable microscopes | — | Yes[3] |
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