Waferpedia

Comparison ledger

xR 200 Sversus160 XP Ion

Applied Materials xR 200 S, Varian 160 XP Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
xR 200 SApplied Materials
OEMApplied MaterialsVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials xR 200 SVarian 160 XP Ion
Cited variants
  • Precision Implant xR 200 S[1]
  • High Current xR 200 S[1]
—
Specifications
Phase3 Phase[2]—
Configuration50/60 Hz[2]150mm High Current IMP[4]
Last Wafer ProcessedMay 2024[3]—
OEMApplied Materials[2]—
ModelxR 200 S[2]—
CategoryIon Implantation[3]—
Wafer Sizes8 inch[2]—
Power3 Phase[3]—
Frequency50/60 Hz[2]—
VacuumCryo pump[3]—
Gas deliveryGas cylinders removed[3]—
Gas lines and beamlinePurged with N2[2]—
Includes Spare Parts3 spare sources; 2 bushings; 3 MRS (Mass Revolving System); 2 source housing; Flight tube; Many parts for source maintenance and tool maintenance[2]—
Wafer Size8 inch[2]—
Power Phase3 Phase[2]—
Power Frequency50/60 Hz[2]—
AutomationFully Automated[2]—
Vintage2003[2]—
Vacuum PumpCryo pump[2]—
Gas DeliveryGas cylinders removed; gas lines and beamline purged with N2[2]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com