Comparison ledger
Applied Materials Vantage Radiance Plus RTP, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Vantage Radiance Plus RTPApplied Materials | |
|---|---|---|
| OEM | Applied Materials | CEE |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | (2) 25-wafer ADOE FOUP Load ports | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Vantage Radiance | CEE 1000 Hot Plate |
| Specifications | ||
| Configuration | 2 chambers[1] | 4"[6] |
| Factory Interface | 5.3[2] | — |
| Wafer size | (2) 25-wafer ADOE FOUP Load ports[3] | — |
| Chambers | 2[1] | — |
| Wafer handling | (2) 25-wafer ADOE FOUP Load ports[2] | — |
| Version | 300 mm[4] | — |
| Vintage | 01.06.2010[5] | — |
| Type | — | Hot Plate[6] |
| Wafer Size | — | 4 inch[6] |
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